excellent Thermal paste heatsink paste
Benefits:
Conformable with very low compression forces
Will not cause corrosion on any metal surface
Introduction:
G200 is a highly conformable/thermally conductive, high viscosity type silicone compound. It provides a thermal solution for the recent trends of integrating higher frequency electronics into smaller devices. G200 easily forms and adheres to most surfaces, shapes, and sizes of components.
Features
.Thermal conductivity: 2.0/3.0/5.0 W/M-K
. Low thermal resistance
. RoHS & UL compliance
Applications
. CPU and Chipset cooler
. Switching mode power
. Electronic Home compliance
. LED industry
. Others
Store Method:
. This item can be saved for 18 months when it is sealed under room temperature 25°C.
Physical Properties:
PROPERTY | G-200 | G-300 | G-500 | TEST METHOD | UNIT |
Density | 2.3 | 2.7 | 3.2 | ASTM D792 | --- |
Color | Gray | Gray | Gray | --- | Visual |
Volatile Content | 0.5 | 0.3 | 0.2 | ASTM E595 | %/Wt |
Thermal Conductivity | 2.0 | 3.0 | 5.0 | ASTM D5470 | W/mK |
Thermal Resistance | 0.041 | 0.025 | 0.009 | ASTM D5470 | C-In2/W |
Breakdown Voltage | 1100 | 1000 | 600 | ASTM D149 | VAC/mil |
Dielectric Constant | 4.5 | 4.7 | 4.8 | ASTM D150 | --- |
Volume Voltage | >1013 | >1013 | >1012 | ASTM D257 | --- |
Work Temp | -50°C to 200°C | ||||
About Us:
Payment term:
1.For small amount ,TT,Paypal,Western Union are accepted.
2.For big amount,TT,L/C are accepted.
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