Shenzhen ZZX-601 Thermal silicone glue very adhesive   

Features                                                                             Applications                             

. Thermal conductivity:1.2 W/M-K                           . Electronic devices         

. Single-component                                                 . Power            

. Auto-removing foam                                              . Heat and electricity transducer

. Good high and low termperature resisitance        . Thick film IC

. Good physical and chemical stability                    . Metal/Plastic/ceramics BaseLayer

. RoHS and UL compliance                                     . Others

Method of Use

. Mix it round slightly before use.

. Cover it closely after use, so as to avoid solidifying when contacting air.

lAvoid moisture, dirt and other atmospheric composition

lRelieve mechanical, thermal shock and vibration of mechanical stress and tension.

lHave excellent electrical insulating performance.

lOutdoor aging, excellent service life up to 20-30 years

lIn the -60-260 °C it has stable mechanical and electrical properties

lFire resistance

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