No.

 items

Spec

1

  Layers

1 to 24 layer

2

 Max working panel area

457 x 610 mm

3

  Min board thickness

4 layer: 0.40mm

6 layer: 0.80mm

8 layer: 1.00mm

10 layer: 1.20mm

4

  Min trace width

0.10mm

5

  Min spacing

0.10mm

6

  Min hole diameter

0.20mm

7

  Min Copper thickness in hole

0.020mm

8

  PTH size tolerance

±0.05mm

9

  NPTH size tolerance

±0.025mm

10

  Hole position tolerance

±0.05mm

11

  Dimension tolerance

±0.1mm

12

  Min solder mask dam

0.08mm

13

  Insulation resistance

1E+12 Omega(normal condition)

14

 Max Board thickness/Hole size Rate

10 : 1

15

Thermal shock endurance

288 3 times in 10sec

16

  Max Board twist and wrap

≤0.7%

17

  High Vlotage endurance

1.3KV/mm

18

  Copper foil peel off endurance

1.4N/mm

19

  Hardness of  resist ink

≥6H

20

  Flame resistance

94V-0

21

  Impedance control

±5%

22

Certificate

ISO 9001:2000;ISO14001;ISO/TS16949:2002

UL E203640