layer

1-18 layer

Material

FR-4,CEM-1,CEM-3,High TG,FR4 Halogen Free,FR-1,FR-2

Board thickness

0.2mm-4mm

Max.finished board side

800*508mm

Min.drilled hole size

0.25mm

min.line width

0.075mm(3mil)

min.line spacing

0.075mm(3mil)

Surface finish/treatment

HALS/HALS lead free,Chemical tin,Chemical Gold,

Immersion gold Immersion Silver/Gold,Osp,Gold Plating

Copper thickness

0.5-4.0oz

Solder mask color

green/black/white/red/blue/yellow

Inner packing

Vacuum packing,Plastic bag

Outer packing

standard carton packing

Hole tolerance

PTH:±0.076,NTPH:±0.05

Certificate

UL,ISO9001,ISO14001,ROHS,CQC

profiling punching

Routing,V-CUT,Beveling

Quantity

Prototype&Low Volume PCB Assembly,from 1 Board to 250,is specialty,or up to 1000

Type of Assembly

SMT,Thru-hole

Solder Type

Water Soluble Solder Paste,Leaded and Lead-Free

Components

Passive Down to 0201 size

BGA and VFBGA

Leadless Chip Carriers/CSP

Double-sided SMT Assembly

Fine Pitch to 0.8mils

BGA Repair and Reball

Part Removal and Replacement

Bare Board Size

Smallest:0.25*0.25 inches

Largest:20*20 inches

File Formate

Bill of Materials

Gerber files

Pick-N-Place file

Types of Service

Turn-key,partial turn-key or consignment

Component Packaging

Cut Tape,Tube,Reels,Loose Parts

Turn Time

Same day service to 15 days service

Testing

Flying Probe Test,X-ray Inspection AOI Test

PCB Assembly Process

Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing