large size SMT reflow oven for electronic components E8
large size SMT reflow oven for electronic components E8
large size SMT reflow oven for electronic components E8
large size SMT reflow oven for electronic components E8
large size SMT reflow oven for electronic components E8

large size SMT reflow oven for electronic components E8

USD $17,000 - $25,000 /Set

Min.Order:1 Set

Supply Ability:
1000 Set / Sets per Month
Port:
Shenzhen port
Payment Terms:
T/T Credit Card PayPal

Quick Details View All >

Place of Origin:
Guangdong, China
Brand Name:
ETA
Model Number:
E8
Usage:
solder paste heating,PCBA,led heating
Voltage:
380V/3 phase
Weight:
2300KG

Shenzhen ETA Electronic Equipment Co., Ltd.

Business Type: Manufacturer,Trading Company,Agent
Shenzhen Guangdong China
Main Products: SMT MOUNTER ,REFLOW OVEN ,Dispenser Machine ,smt pick and place machine ,wave soldering machine

Product Details

      large size SMT reflow oven for electronic components E8

Company Information

 large size SMT reflow oven for electronic components E8large size SMT reflow oven for electronic components E8large size SMT reflow oven for electronic components E8large size SMT reflow oven for electronic components E8

 large size SMT reflow oven for electronic components E8

Features:

1.Control System: PC + Siemens PLC control system,accurate temperature control and more stable,ensures temperature stability rate to be more than 99.99%. 

2.Hot air system: first-class heating module, the best temperature zone interval design makes optimum temperature uniformity and repeat.The effective utilization and thermal compensation efficiency,it needs less than 20 minutes from temperature control accuracy ± ℃ ambient temperature to a temperature stabilization .

3.Monitoring Software:Windows interface, traditional and simplified Chinese and English online free switch, and operator password management, easy to operate.Operation records, temperature curve measurement and analysis functions, virtual simulation, fault self-diagnosis, process monitoring, automatic generate and save process control documents, substrate transport dynamic display. 

4.Cooling System: new cooling zone, quick and easy adjustment, easily reach the cooling requirements of different slopes.

5.Temperature protection:ETA using third-party over-temperature protection, multiple layers protection to ensure safe operation. 

6.Products comply with CE, CCC, UL , other standards and specifications.

7.User-friendly design: fault detection (such as heaters abnormal alarm, etc.), regular maintenance reminders, the economy functions and tool-free maintenance, reducing equipment failure rates.

8.Heating module: Transverse reflow design makes temperature from each zone is not influenced by neibour to ensure accurate temperature curve, while ensuring a high production capacity and heat exchange capacity to achieve high adaptability (to meet the soldering of automotive, communications, electronics, computers and mobile phones consumer electronics.)

9.Hot air motor with independently inverter controlled, set operating frequencies depending on different technology to meet a variety of lead-free processes.  

10. Machine using zero gas source design, furnace cover with motor lifting, safety rod support, providing significant security.

11.Main parts:Imported main parts ensure equipment runs smoothly and lower the maintenance cost.

12. Customers can choose optional flux processing system according to their own production features  to ensure furnace chamber clean. 

13.Closed-loop transmission speed control systems, transportation accuracy ± 2mm / min, ensuring more stable transmission speed. 

14.Central support, dual transmission, external water cooling system is optional.

 

Application  

Widely used in high precision products like 01005-QFP, BGA, CSP, Flip,and POP ,automotive electronics, mobile devices, home appliances, communications, LED, semiconductor and other industries.  

Specification:

ETA Reflow Oven Specifications

S - Standard, O - Option, M - Manual, A - Auto, N/A - Not Availible)

Specifications 

E8

E10

Specifications 

E8

E10

Dimension (L*W*H)mm

5310x1353x1490

6100x1353x1490

Board Dropped Alarm           

S

S

Standard Color 

Computer Grey

Computer Grey

Electrical SMEMA Interface 

S

S

Weight

Approx.2150KG

Approx.2400KG

Computer 

Lenovo

Lenovo

Number Of Heating Zones                      

Up8/Bottom8

Up10/Bottom10

Max.Width Of PCB                     

400mm

400mm

Length Of Heating Zones                     

3121mm

3891mm

Temperature Deviation on PCB 

± 1.0℃  

± 1.0℃  

Rail Width Adjustment                           

A and M(Multi mode)

A and M(Multi mode)

Max. Temp. Gap Between Preheat Zones Setting  

40℃

40℃

Rail Number 

1 Lane or 2 Land

1 Lane or 2 Land

Temperature Control Precision     

± 1.0℃

± 1.0℃

Exhaust Volume                

10M3/minx2 Exhausts

10M3/minx2 Exhausts

Conveyor Height 

900+/-20mm

900+/-20mm

Control System 

PLC+Computer

PLC+Computer

Length Of Cooling Zones                        

600mm

600mm

Transmission Agent 

 Chain + Mesh     

 Chain + Mesh     

Center Support 

O

O

Electric Supply Required

3phase,380V 50/60Hz                                                            

3phase,380V 50/60Hz                                                            

Siemens PLC 

S

S

Power For Warm Up 

30KW

36KW

Lubrication Auto-Afflux                               

S

S

Power Consumption 

8KW

12KW

Ups           

S

S

Warming Time 

Approx.25 minute

Approx.25 minute

Temp. Thermocouple Slot                

S

S

Temp. Setting Range              

Room Temp.-- 300℃

Room Temp.-- 300℃

Driven Top Hood Opening                           

A

A

Oil Supply                                    

A and M(Multi mode)

A and M(Multi mode)

Temperature Control Method PID + SSR                    

S

S

Conveyor Speed Range

300~2000mm/min

300~2000mm/min

Number of Cooling Zones                  

2

2

Components Clearance 

Top/ Bottom is 25mm

Top/ Bottom is 25mm

On Line Editing    

S

S

Conveyor Direction                 

L→R (Option: R→L)

L→R (Option: R→L)

Max.Temp.Gap Between Preheat & Reflow Setting 

80℃

80℃

Commutated Element            

Aluminum Alloy Plate (8mm) 

Aluminum Alloy Plate (8mm) 

Max. Temp. Gap Between Reflow Zones Setting 

50℃

50℃

Fixed Rail Side                            

Front Fixed  (Option:Rear  Fixed)

Front Fixed  (Option:Rear  Fixed)

Process Data & Status Storage

S

S

Cooling Method

Forced-Air Motor and fan (Standard)         

Forced-Air Motor and fan   (Standard)         

Temperature Alarm                  

S

S

 

Contact Supplier

Mr. henry wang SALES Chat Now
Telephone
86-0755-27428080
Mobile
13825286023
Fax
86-0755-27428090
Address
No. 3, Road 3, Yangyong Industrial Area, Shapu, Songgang St., Bao'an Area Shenzhen,Guangdong

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