MPM automation SMT stencil PRINTER

Speedline’s MPMPrinters continue to be the leaders in automated printing technology for electronic materials in printed circuit board assembly and manufacturing. Printing with traditional screens, or with metal foil stencils, MPM Printers uniformly deposit solder paste, as well as masks, epoxies, adhesives, and other printable materials onto bare rigid or flexible PCBs in one of the key steps in the assembly process.

MPM Printers print the solder paste that forms the physical and electrical connections for standard as well as fine and ultra-fine pitch components on today’s challenging, advanced electronic products for industrial, consumer, and military and aerospace uses.

MPM printers deliver superior results with today’s advanced metal foil stencils. Whether stencils are chemical or laser etched, conventional or stepped, standard or fine pitch, MPM printing technology with advanced-design metal squeegee blades or the EnclosedFlow™ print head achieves superior results with all electronic materials, from solder paste to silicones.

Recognized worldwide for precision solder paste deposition on PCBs, MPM printers deliver fewer print defects and optimum aperture fill with the finest feature printing. Superb results are achieved with all types of solder paste, including lead-free and traditional tin/lead formulations, and all particle sizes for defect-free deposition and optimum aperture fill.