high full-auto welding BGA rework station for SAMSUNG motherboard reballing
high full-auto welding BGA rework station for SAMSUNG motherboard reballing
high full-auto welding BGA rework station for SAMSUNG motherboard reballing
high full-auto welding BGA rework station for SAMSUNG motherboard reballing
high full-auto welding BGA rework station for SAMSUNG motherboard reballing
high full-auto welding BGA rework station for SAMSUNG motherboard reballing

high full-auto welding BGA rework station for SAMSUNG motherboard reballing

USD $4,999 - $5,500 /Set

Min.Order:1 Set

Supply Ability:
100 Set / Sets per Month
Port:
SHENZHEN
Payment Terms:
T/T L/C D/P D/A Credit Card PayPal

Quick Details View All >

Place of Origin:
Guangdong, China
Brand Name:
ETA
Model Number:
ETA-6200

Shenzhen ETA Electronic Equipment Co., Ltd.

Business Type: Manufacturer,Trading Company,Agent
Shenzhen Guangdong China
Main Products: SMT MOUNTER ,REFLOW OVEN ,Dispenser Machine ,smt pick and place machine ,wave soldering machine

Product Details

Product Description

 high full-auto welding BGA rework station for SAMSUNG motherboard reballing

Features:
3 independent control heaters 
Top and bottom heaters are hot-air heating, the third IR heater is infrared heating, the top and bottom heaters can heat PCB from upper and bottom at the same time. Temperature accuracy within ± 3 degree, there are multi segments can be set at the same time; IR preheating area is adjustable according to desire requests, to make PCB heating evenly. 
It can heat PCB board and bga chips at the same time. And the third IR heater can preheat the PCB board from bottom, to avoid PCB from deformation during repair process. The top and bottom heaters heat independently; 
Choose high accurate K type close-loop thermocouple, and PID parameters automatic adjustment system; It can show seven temperature curves and the millions of groups data can be saved through U storage device, with instant curves analysis function and analyzing BGA temperature at any time; The sensor is for precise temperature testing. 
Precise optical alignment system 
Adopt adjustable CCD color optical system, with a beam split, zoom in, zoom out and micro-adjust functions, has automatic chromatism resolution and brightness adjustment system, amplify to 230 X, mounting accuracy within ± 0.01mm. 

Multi-function operation system 
Adopt high definition human-machine interface, available for setting "set up" and "operate" to avoid error settings, The top heater device and mounting head 2 in 1 design, with automatic identify BGA chips and mounting height, it is of automatic soldering and desoldering function. It can set 6 segments rising temperature and 6 segments activity temperature, and can save N groups temperature profiles. Adopted all kinds of BGA nozzles, with 360° Rotation, easy for installation and replacement, customized is available; 
V-groove PCB support, with rapid, convenient and accurate positioning, can fit for all kinds of PCB board; Flexible and removable universal fixture has protective effects and no damage to the PCB board, suitable for all kinds of sizes of BGA repair. 

Superior safety functions 
With CE certification; After desoldering and soldering, there is alarming. When temperature goes out of control; The circuit will automatically power off, it is of double over-temperature protection function. Temperature parameter has a password to avoid from arbitrary changes, with superior safety protection functions, can protect PCB board components and the machine from damage at any abnormal situation. 

Specifications and technical parameters 
Power: AC 220V± 10% 50/60 Hz 
Total Power: Max 5300W 
Heater power: Top heater 1200 W Bottom heater 1200 W IR heater 2700 W 
Electrical materials: Intelligence Programmable controller, support connect computer 
Temperature control: K-type thermocouple (Closed Loop), independence temperature control, accuracy within± 3 degree 
Positioning: V-groove, PCB support 
PCB size: Max 410× 370 mm Min 65× 65 mm 
BGA chip: Max 80× 80mm Min 2× 2 mm 
Dimensions: L640× W630× H900 mm 
Sensors: 1 pc 
Weight: 68kg 
Color: White

 

Packaging & Shipping
Packaging Details:Wooden case for export
Delivery Detail:15 work days

high full-auto welding BGA rework station for SAMSUNG motherboard reballing

high full-auto welding BGA rework station for SAMSUNG motherboard reballing 

Our Services

high full-auto welding BGA rework station for SAMSUNG motherboard reballing 

Factory Workshop

high full-auto welding BGA rework station for SAMSUNG motherboard reballinghigh full-auto welding BGA rework station for SAMSUNG motherboard reballinghigh full-auto welding BGA rework station for SAMSUNG motherboard reballing 

Company Information

high full-auto welding BGA rework station for SAMSUNG motherboard reballing

high full-auto welding BGA rework station for SAMSUNG motherboard reballing
high full-auto welding BGA rework station for SAMSUNG motherboard reballing

high full-auto welding BGA rework station for SAMSUNG motherboard reballing 

FAQ

 After-sales service:

1.Pre-consultation: provides professional SMT solutions for the full line.

2.Factory Warranty: One-year warranty factory service. 

3.Installation: On-site installation and commissioning, to ensure smooth production

4. Technical Training: provides professional training from Level 1 to Level 3

5.Technical support:provides 7 * 24 technical support

6.Software Upgrade: offers lifetime free software upgrades for all products

 

Contact Supplier

Mr. henry wang SALES Chat Now
Telephone
86-0755-27428080
Mobile
13825286023
Fax
86-0755-27428090
Address
No. 3, Road 3, Yangyong Industrial Area, Shapu, Songgang St., Bao'an Area Shenzhen,Guangdong

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