Insulation PI Polyimide Film, PI film

Description

Polyimide Film is synthesized by the polycondensation of aromatic dianhydride and aromatic diamine (PMDA and ODA ). It shows outstanding physical , thermal, electrical, and chemical properties over a wide range of temperature as low as -452F(-269C) and as high as 500F(+260C).It also offers good dimensional stability and can be die-cut, laminated, metallized, formed, thermoformed or adhesive coated.

Features

Operating temperatures: Class H (180’C)

Unique combination of electrical, thermal, chemical and mechanical properties

Applications

It’s extensively used in electrical insulation, flexible printed circuits, bar code labels, pressure sensitive tape and safety applications

Insulation PI Polyimide Film, PI film

Available

Thickness: (um/mil)

7.6/0.3, 10.2/0.4, 12.7/0.5, 15/0.6, 19.1/0.75, 25.4/1.0, 50.8/2.0, 76.2/3.0

Width: 260mm, 520mm, 620mm

Length: 500m, 750m, 1000m, 1500m, 3000m

Any special size is available on request