Product Details

LY HR8000 bga reball machine with 3 temperature heating areas

Introduction

HR8000 Rework station for laptop motherboards, desktop computer motherboards, server boards, industrial computer boards, all kinds of game boards, communications equipment motherboards, LCD TVs and other large circuit board BGA rework.

HR8000 is Preheat independent infrared ceramic three-zone temperature control rework station, easy to lead-free rework;

Technical Parameters

Basic Parameters
Heating	HR
Dimension	L480mmx W450mmx H650mm
Weight	28kg
Total weight	About 40 kg, vary with the differen need of the users
Electrical Parameters
Power	220V AC
Upper Heating	HR
Size of upper (IR)	---------------
Consumption of upper (IR)	---------------
Nozzle of upper(HR)	3 pcs: 31x31, 38x38, 41x41,
Consumption of upper (HR)	800W
Bottom Heating	HR
Nozzle of bottom(HR)	1 pcs: 55x55 mm
Consumption of bottom (HR)	800W
Bottom Preheat	IR
Consumption of preheat (IR)	2700W
General power	4.8KW
Temperature Control
Control mode of Upper	Independent temperature control, high-precision closed-loop control, precision ± 0.5%, Alarm
Control mode of Bottom	Independent temperature control, high-precision closed-loop control, precision ± 0.5%, NO Alarm
Rework Function
SMD	Suit for welding, remove or repair packaged devices such as BGA,PBGA,CSP,multi-layer substrates, EMI metallic shield product and solder/lead free Rework welding
Size of applicable chips	?80mm x80 mm
Size of applicable PCB	?415mm x325mm