Product Details

bga reball machine LY IR8500

CE Certification
can be connected to a computer
8 constant temperature segments
It can easily rework the variety of CPU's seat

Video:

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Introduction

LY IR8500 Rework station for laptop motherboards, desktop computer motherboards, server boards, industrial computer boards, all kinds of game boards, communications equipment motherboards, LCD TVs and other large circuit board BGA rework.

LY IR8500 innovative designs an effective solution to general of infrared rework station vulnerable to the impact of air flow. will lead an inaccurate of temperature control can easily deal with lead-free soldering rework.

Technical Parameters

Basic Parameters
Heating	IR
Dimension	L780mmx W450mmx H260mm
Weight	18kg
Total weight	About 21 kg, vary with the differen need of the users
Electrical Parameters
Power	220V AC
Upper Heating	IR
Size of Upper heating	80mm x 80mm
Consumption of upper heating	450W
Bottom Heating	IR
Size of Bottom heating	400mm x200mm
Consumption of Bottom heating	1600W
General power	2050W
Temperature Control
Control mode of Upper	Independent temperature control, high-precision closed-loop control, precision ± 0.5%, Alarm
Control mode of Bottom	Independent temperature control, high-precision closed-loop control, precision ± 0.5%, NO Alarm
Rework Function
SMD	Suit for welding, remove or repair packaged devices such as BGA,PBGA,CSP,multi-layer substrates, EMI metallic shield product and solder/lead free Rework welding
Size of applicable chips	≤70mm x70 mm
Size of applicable PCB	≤400mm x305mm