Product Details

R5860C infrared BGA Rework Station with Monitor

Place of Origin Guangdong, China
Brand Name FUNDAR
Model Number 5860C
Voltage 220V
Current 50/60hz
Rated Capacity 5200W
Rated Duty Cycle 100
Dimensions 710*680*660mm
Weight 105kg
Usage repair motherboards

Product Features

Specifications

1.R5860C BGA Rework Station
2.Infrared BGA Rework Station
3.IR Heating BGA Rework Station
4.High power Rework
5.CE

R5860C BGA Rework Station
Infrared BGA Rework Station
IR Heating BGA Rework Station
High power Rework
Convenient use

 

 

BGA rework station infrared rework station R5860C

1. Specifications:

1

Power consumption

5200W

2

Top Heater

800W

3

Bottom Heater

2nd Temperature Zone (Infrared plates)

3000W

3rd  Temperature Zone (Hot-air Nozzle)

1200W

4

Power Requirement

AC 220V ± 10  50Hz ± 3

5

Machine Dimension

L710 x W680 x H660mm

6

Positioning

V-groove.

7

Temperature control

Imported closed loop K-type thermocouple

8

Max. PCB size

450*400mm

9

Net Weight

105kgs


2. Features:


1. The machine used touch-screen interface and PLC control to show the three temperature graphs at any time, so that the temperature error can be controlled within 1°.

2. Have 7 temperature sections for control such as preheating, insulation, heating, welding 1, welding 2, cooling and refrigeration. The excellent temperature control system ensures the effectiveness of welding.

3. It can save 1 to 100 groups of graph parameters at one time. It can analyze the graphs and change the settings at any time on the touch screen.

4. There are three independent heating areas from top to bottom. the first and second temperature areas can control many groups & sections of temperature parameters at the same time. The third area preheats the PCB thoroughly to achieve the best welding effect. Temperature, time, slope, cooling and alarming all display on the touch screen.

5. Choose imported high-precision K-Sensor with closed-loop to detect up/down temperature precisely. 

6. After finishing desoldering & soldering, there is an alarming. When the temperature goes beyond control, the electric circuit can cut off automatically, with over-heating protection.

7. Use a powerful cross-flow fan to cool PCB rapidly to prevent it from deformation and ensure the welding effect.

8. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB.

9. For large thermal capacity of PCB/CSP or other high-temperature lead-free requirements, all can be handled easily.

10. The hot air nozzle can rotate 360° freely and it's easy to replace. Offering BGA nozzles of different sizes for you to replace easily. Nozzles of special requirements are customizable.

 

3. Packing List:

Item No.Item NameQuantityUnit
1R5860C1pcs
2Fixture6pcs
3M5*30 Supporting screw6pcs
4Plum blossoms handle6pcs
5Temperature sensor1pcs
6Vacuum sucker2pcs
7Nozzle 31*311pcs
8Nozzle 38*381pcs
9Nozzle 41*411pcs
10Nozzle 20*701pcs
11Nozzle 35*351pcs
12Brush1pcs
13LCD monitor1pcs
14Instruction Book1pcs


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