180pcs heat directly bga stencil

180pcs heat directly bga stencil

Negotiable /Set

Min.Order:1 Set

Supply Ability:
1000 Piece / Pieces per Month
Port:
Shenzhen
Payment Terms:
T/T Credit Card

Quick Details View All >

Place of Origin:
Guangdong, China
Brand Name:
FUNDAR
Model Number:
heat directly bga stencil

Shenzhen Fundar Technology Limited

Credit Member 4 years
Business Type: Manufacturer,Distributor/Wholesaler
Shenzhen Guangdong China
Main Products: BGA Rework Station

Product Details

Specifications

1.180pcs heat directly bga stencil
2.BGA Reballing Stencil Templates
3.heat directly
4.Thickness: 0.3mm
5.newest

180pcs heat directly bga stencil

Thickness: 0.3mm
Weight: 17.7g/pc
Material: # 304 Stainless Steel

 
(a) 0.3MM Ball(3pcs)
82HM57//GS45
82801IUX
00.3mm universal stencil (pitch = 0.5mm) (20 * 20mm)

(b) 0.35MM Ball(2pcs)
82HM55//82GM55
0.35mm universal stencil (pitch = 0.65mm) (20 * 20mm)

(c) 0.4MM Ball(7pcs)
I7-620M
CG82NM10
D510-CPU
82P55
82P45//G41
82PM45//GM45
0.4mm universal stencil (pitch = 0.7mm) (29.5 * 29.5mm)

(d) 0.45MM Ball(4pcs)
DDR1
DDR2 
DDR3//XBOX360
0.45mm universal stencil (pitch = 0.8mm) (29.5 * 29.5mm)

(e) 0.5MM Ball(42pcs)
LGA1156
MCP79IU-SLI-N-B1
STI 7162
GF106-250-KA-A1
GF100-030-A3
215-0735003
215RGMDKA13FG
GF104-325-A1
NVBR04-300-A2
ATI218-0697010
307ELV
NVG96-600-A1//G98-600-A1
ATI215-0719090
ATI215-0669065
G94-300-A1//G94-210-A1
IXP600//SB600
RS800ME//RS600ME
SB700//RD780
MCP67//MCP77//MCP87
945GMS//GSE
945GM//PM
945P//GC//PL
IXP460
965P//G31
ATI1100//RS485M//RS485MC
NV 6100//8200//8300//8400
NV 7200//7300//7400//G84-630-A2
ATI 21514//M72-M//M74-M
ATI 21515//M64-S//M72-S//M82-S
ATI 200M RC415ME
915GMS
ATIX1300
965GM//965PM
ATI 215-0308003//0743SSP
NV G200-103
NV NF7050//7100//7150
NF6801-SLI-N-A2
NV BR03-N-A3
MSPII
NV MCP7A-P-A1//MCP79S//MCP79M
216-0728020//0725013//0725007
0.5mm universal stencil (pitch = 0.8mm) (29.5 * 30.5mm)

(f) 0.6MM Ball(79PCS)
LGA1366
VT8251
BCM6368
RC82540EM
GF420 GO 32M
SIS662
VIA P4M890
M1573 A1
VX700
ATI 215-0718020
SIS655FX
PN800
82801HB
M6-C16
SIS756
BCM56639
QG500P
K8M890
CX700M
M1697-AIB
SIS 648FX
775CPU
MT5388
MT5363
218BAPAGA12FG
GO6800-B1//GO7800//GO7900
FX5900//GO6800LE
NF550//570
SIS 661
9200//9550//9600//9700//X300//X700
GO6200//7200//7300//7400//G86-770//771
4200GO
7500//9000
IXP400
AIT200M//RS480M//M64-P
9000-64M
SIS 671
RC410
865PE
VT8237S
NF4
VT8237A
ATIx1600//X1650
SIS 964
MX440
NF-430-N-A3//NF-410
915GM//PM
NF-6150//NF-SPP
HSI-A4
FXGO5200
GO5200
NV896//CN896
82801GBM
82801FBM
82801HBM
845GL//GV
NF-250
915P
X1800
9000IGP
9100IGP
FX5700
R480
X38
82801BA
82801IB//IR
SIS 968
SIS 965
VT8237R
G80-100-K1-A2
R360
X58
ATI 9600-T2
VT8235M
420GO
1825-0206
0.6mm universal stencil (pitch = 0.9mm) (38.5 * 38.5MM)
0.6mm universal stencil (pitch = 1.0mm) (41 * 41MM)
0.6mm universal stencil (pitch = 1.1mm) (33 * 33MM)

(g) 0.76 Ball(33pcs)
MCP8245
CPU AM2
CPU AM3
VIA P4M266A
BCM3349
216PSZBFA22H
SIS 760LV
VIA K8T800
VIA K8M800
VIA P4M800
AMD SOSKET SI CPU
320M/330M/340M/345M
MCP8245AR
RG82875
478CPU
BCM53242
SIS 962//SIS963
845MP//855PM
855GM//GME
M1671
82801EB
82801DBM
SIS 630S
SIS 630E
SIS 650
479CPU
VN800
IXP150
M1535+
PN133T
VT82C686B
AMD 754CPU
0.76mm universal stencil (pitch = 1.27mm) (41.5 * 41.5MM)

(h) 20 pcs directly heated BGA Stencils for XBOX/PS3/WII GUP CPU  (20PCS)

(i) 0.5MM Ball (1pcs)   
WII    CPU (New version)

(ii) 0.6MM Ball (18pcs)
WII    GPU (New version) 
WII    GPU (Old version)
WII    CPU (Old version)
XBOX360  GPU
XBOX360  CPU
XBOX360  CSP
XBOX360  HANA
PS3    GPU
PS3    CPU (New version)
PS3    CPU (Old version)
PS3   CXR714120
CXD2973GB
CXD9833GB
CXD2964GB
CXD2976GB
CXD29808GB 
CXD2992GB
CXD2949CGB

(iii) 0.76MM Ball (1pcs)
CXD9799GB

Contact Supplier

Ms. Hellen Wong Manager Chat Now
Telephone
86-755-83972411
Mobile
15013678067
Fax
86-755-83972411
Address
20th Floor, Nanguang Jiejia Building, No.3037 Shen Nan Road, Futian District, Shenzhen, China Shenzhen,Guangdong

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