Specifications

Feature:

1.Suitable for all of the component , especially Micro BGA component.

2.adopt infrared weld technology.

3.Simple operation.

4.able to work on component of 15x15 to 35x35mm

5.650W heating system, widely to 120x120mm

6.sirocco flow.

Parameter

Operation method

1. Locate, choose and attach the appropriate lens:
The usable of the lenses diameter are 28mm, 38mm, 48mm.
(1)When the area of the chips is below 15mm*15mm, please choose the IR-lamp temperature about 160-240°C, and choose the lens which D=28mm to avoid destroying other places, usually it will take you about 20-40seconds.
(2)When the area of the chips is between 15mm*15mm and 30mm*30mm, please choose the IR-lamp temperature about 240-320°C, and choose the lens which D=38mm to avoid destroying other places, usually it will take you about 30-60seconds.
(3)When the area of the chips is above 30mm*30mm, please choose the IR-lamp temperature 350°C(Attention: you should turn on the pre-heat dish first, and set-up the temperature about 150-200°C,wait 3-5minutes to allow the temperature steady on the set-up temperature),and choose the lens which D=48mmto avoid destroying other places, and keep the lamp body direct light. You should control the time carefully to avoid burning the chips.
Warning:
The light system will shoot straightly. Please pay more attention to yourself control time to avoid burning out.