Product Details

3 Temperature Areas Touch Screen with Soldering Pen BGA Chip Repair Machine LY HR560 Laser BGA Reballing Machine

Product Description

Introduction:

HR560 Rework station for laptop motherboards, desktop computer motherboards, server boards, industrial computer boards, all kinds of game boards, communications equipment motherboards, LCD TVs and other large circuit board BGA rework.

HR560 is Preheat independent infrared ceramic three-zone temperature control rework station, easy to lead-free rework;

HR560 is 2 in 1 model, hot air heating and soldering station; the soldering station can working independent;

HR560 is Embedded industrial PC, high definition touch screen, human-machine interface operation;

Technical Parameters

Basic Parameters
Heating	HR
Dimension	L700mmx W650mmx H650mm
Weight	45kg
Total weight	About 60 kg, vary with the differen need of the users
Electrical Parameters
Power	220V AC
Upper Heating	HR
Size of upper (IR)	---------------
Consumption of upper (IR)	---------------
Nozzle of upper(HR)	3 pcs: 31x31, 38x38, 41x41,
Consumption of upper (HR)	800W
Bottom Heating	HR
Nozzle of bottom(HR)	2 pcs: 34x34, 55x55 mm
Consumption of bottom (HR)	800W
Bottom Preheat	IR
Consumption of preheat (IR)	2700W
General power	4.8KW
Temperature Control
Control mode of Upper	Independent temperature control, high-precision closed-loop control, precision ± 0.5%, Alarm
Control mode of Bottom	Independent temperature control, high-precision closed-loop control, precision ± 0.5%, NO Alarm
Rework Function
SMD	Suit for welding, remove or repair packaged devices such as BGA,PBGA,CSP,multi-layer substrates, EMI metallic shield product and solder/lead free Reworkwelding
Size of applicable chips	≤80mm x80 mm
Size of applicable PCB	≤415mm x325mm