1.High stability
The semiconductor pump laser marking system uses semiconductor technology to replace traditional electro vacuum technology and the excitation source uses high power semiconductor matrix, extending the service life of the product and system stability significantly.  
2.High precision
The output beam of semiconductor pump laser marking system is closer to ideal mode and is more suitable for hyperfine process. The minimum character size is 0.2nm, making the precision of the laser marking reach a new order of magnitude.
3. High speed
The semiconductor pump laser marking system uses hyperfine optic devices and its galvanometer speed is much higher than traditional laser system.
4. Low energy consumption
The semiconductor laser marking system uses highly efficient semiconductor matrix, improving the laser conversion efficiency significantly.
5. High reliability
The semiconductor laser marking system is highly integrated and no high voltage power supply or high voltage device is required, ensuring the reliability of the system.
6.Small size
The highly integrated control system allows customers to make better use of the plant space.

Carve metal and nonmetal materials; more suitable for circumstances that require super fine and high precision.
It is applied to electronic components, integrated circuit (IC), electric apparatus, mobile communication, hardware products, tool fittings, precision instrument, glasses, watch and clock, jewelry, automobile parts, plastic keys, construction materials, PVC pipes, medical instruments, etc.
Suitable materials include: common metal and alloy (all metals include iron, copper, aluminum, magnesium and zinc), rare metal and alloy (gold, nickel, and titanium), metal oxide, special surface process (phosphating, aluminum anodizing and electroplated surface), ABS material (electric apparatus shell, daily necessities), ink (light-transmitting keys, printing products), epoxy resin (packages and insulating layer of electronic components).