UV Laser Wafer Scribing System()

       TripleScriber is another UV laser scribing system which is sepecially developed for scribing small size chips with high throughput.

Features
• 4 Dimentional high precision adjust system for position
• 3 Co-Axial CCD image indentifying system
• Real-time monitoring for laser power
• Powerful vision system for anti-roughness on chip surface
• High stability shock-proof system with granite
• Process memory system

Application Materials
Sapphire, Ceramic, Quartz, Diamond, Silicon as well as Copper, Cobalt, and many Alloys

Applications
LED and other wafer production industries

Specifications                    UltraScriber / TripleScriber
Chip Size                             ≥ 6 mil
Scribing Depth                   22-45 um
Beam Number                   Single / Three
Rotation Stage                   ±7°with 0.0001°Res.
X-Y axis resolution             0.1 um
Z axis resolution                1 um
Throughput                         > 15pcs/h @ 14 mil