Aluminum thin film material
Negotiable
Min.Order:1
Aluminum is used for PVD metallization in thin-film transistors for TFT-LCD for displays. Aluminum sputtering targets are highly pure and therefore ensure best conductivity of the material. A homogenous microstructure and superior surface quality of the targets guarantee less particle formation during sputtering and uniform erosion.
Material properties:
Density [g/cm3]: > 2,70
Purity [%] > 99,999 (5N)
Hardness [HV1]: 16
Thermal conductivity [W/(mxK)]: 238