Specifications

1. OEM According Custom's drawing or designing
2. Advanced digital Cutting equipment
3. Maintained accuracy when cutting

1) Material:UHMW-PE (Ultra High Molecular Weight PE)

2) CNC milling part

3) OEM According Custom's drawing or designing
4)  Advanced digital Cutting equipment
5) Maintained accuracy when cutting

Component like clamp-ring, holder, CSP chip small package, BGA ball grid array, wafer guide or wafer chunck are being widely used in the field where very high temperature, extreme chemical resistance with extraordinary mechanical properties are essentially required.

Advantage:

 1. Fabricate according drawing

 2. Equipment: CNC Machine Center, Automatic lathe, Router, Milling Machine, Stress relief treatment

3. Economically: MOQ 1 pc, no initial huge investment.

4. Material: UHMW PE ( PE1000), HDPE, PP, POM( ACETAL), ABS, NYLON 6A, MC Nylon, PVC, PTFE(Teflon), PVC, PEEL etc.