Hubless Resin Diamond Dicing Blade for Semiconductor
| FOB Price | USD $80 - 120 / Piece |
| Min.Order Quantity | 1 Piece / Pieces |
| Supply Ability | 1000 Piece / Pieces per Month |
| Port | Shanghai |
| Payment Terms | T/T PayPal Other Cash |
Company Profile
| Business Type | Distributor/Wholesaler |
| Year Established | 2022 |
| We Provide | vitrified bond tools , resin bond tools , metal bond tools , electroplated diamond/CBN tools , Vaccum brazed products |