gas heated wafer biscuit machine production line with 39 plates

Specifications

KHG-39 Gas heated wafer biscuit machine production line with 39 plates

The wafer production line is Kehua Foodstuff Machinery Manufacturer's main products. The baking oven has 39 baking plates and is heated by gas(LNG or LDG). The capacity is about 3.15tons/24h(cream:wafer=1.35:1) .

Features:

a. Full automatic controlled, easier operation and save the labor costs(only need 5 workers to operate the machines).

b. According to HACCP design,with high production effeciency, Stable and reliable operation, long service life.

c. Special energy conservation design, reduce energy consumption.

d. The motors, bearings, PLC and other components adopt international and chinese famous brand.

e. All parts contacting with the food are made from SUS304 Stainless steel and food-grade materials.

f. Making high quality wafer biscuits,the percent of pass (clear design, plump wafer, baked evenly) after the broken wafer collecting machine is up to 98%.

g. Have CE, ISO9001:2000, FM certifications.

h. Provide the best service and perfect after sale service.

Equipment:

The standard configuration of this wafer production line: 1.Batter mixer 2.Baking oven 3.Wafer sheet connecting machine 4.Wafer sheet cooler 5.Wafer sheet collecting machine 6.Cream spreading machine 7.Clooing tower 8.Cold blower/Refrigeration system 9.Wafer book conveyor 10.Wafer cutting machine 11.Cream mixer 12.Smashing machine

Production Process:

           batter mixing ---- wafer baking ---- cooling ---- cream spreading ---- book cooling ---- cutting

1.Batter mixer

a. Dimension: 1720×1100×1000mm.

b. Power: 4.5Kw, the mixing motor power is 3Kw, and the pump power is 0.75Kw×2.

c. It can mix the 25kg flour with water and other materials to be 65kg batter within 3minutes.

2.KHG-39 gas baking oven

a. Gas heating, baking time: 2-3 minutes, standard baking plates size: 470X325mm, the maximum size: 500X350mm, standard pattern size: 2.5X2.5X0.5mm, baking plate surface can be plated with hard chrome.

b. Standard wafer sheet dimension: 464×321×(2.5-3.2)mm, weight of wafer sheet: 50-60g.

c. Gas components: Italy and Japan brand.

d. Motor: SEW of German brand.

e. Pneumatic components: FESTO or SMC.

f. Running wheel bearing: SKF VA201.

g. Pressing roller bearing: SKF Explorer.

h. AC contactor and air switch: Schneider of France brand.

i. Programming unit: Siemens S7-200 of German brand or MISTUBISHI FX-1N of Japan brand.

j. Iinverter: Panasonic of Japan brand or Danfoss of Denmark brand.

k. Touching screen: Siemens Smark line 1000 or Hakko of Japan brand.

l. Photocell: cylinder-shaped Sick of German brand.

m. Proximity switch: SD-105 Optex of Japan brand. 

Main parameter:

3.Wafer sheet connecting machine

a.Dimension: 2300×700×850mm.

b.Power: 0.37Kw.

4. Wafer sheet Cooler

a.Dimension: 1300×700×2300mm.

b.Power: 0.18Kw.

c.Effective cooler holder quantity: 42pcs.

5.Wafer sheet collecting machine

a.Dimension: 2000X700X760mm.

b.Power: 0.18Kw,380v/3Phase/50Hz(SEW).

6. Cream spreading machine

a.Dimension: 3000×1200×1300mm.

b.Total power: 4.12Kw, motor power: 2.62Kw,380V/50Hz; heating power: 1.5Kw,220V/50Hz.

7. Cooling tower

a.Dimension: 3130X1200X3660mm, with 4 layers.

b.Power: 1.11Kw, main motor power: 0.75Kw, conveyor motor power: 0.18KwX2.

c.Effective wafer book holders: 112books.

d.The input cold air temperature: 5 ℃, and the relative humidity is 55%.

8. Cold blower/Refrigeration system

a.Dimension: 2200X1100X1800mm.

b.There are two 5HP compressors.

c.The power of the centrifugal fan is 1.5Kw/380V/50Hz.

d.The temperature range is 0~5℃.

e.The temperature controlling precision: ±1℃.

f.There is one set of evaporator.

g.There is one set of condenser.

9. Cutting conveyor

a.Dimension: 1500×700×(780-1100)mm, weight: 80Kg.

b.Power: 0.18Kw.

10. Cutting machine

a.Dimension: 1620×2300×1240mm,weight: 400kg.

b.Power: 0.75Kw.

c.The maximum cutting speed is 9books/min.

d.The blade point is 0.3mm.

11. Cream mixer

a.Dimension: 1840×850×1350mm,weight: 1000kg.

b.Power: 5.05Kw, mixing motor power: 4.5Kw, turnover motor power: 0.55Kw.

c.The two mixing speeds are 1400r/min and 700r/min.

12. Smashing mahine

a.This equipment is used to grind the discarded wafer in to a reusable form.

b.Power:3Kw.

Remark:

Space: machines using 60 square meter

Packaging: iron and waterproof membrane

Container: one 40’HQ

Warranty: one year

[Note]: We can make different pattern for the plate according to client’s demands. 

If you would like the baking oven heated by electricity, please click here:

http://kehuachina.en.china.cn/product/60008571645-50118489/Professional_wafer_biscuit_machine_wafer_production_line_with_39_plates.html