Delivery Time:7-10days
1 - 4 Layers, CEM-1, Halogen Free, OSP Surface Treatment Flexible Printed Circuit Board
Detailed Product Description:
1) Min. Trace width: 0.004\"
2) Min. Space between trace: 0.004\"
3) Min. Hole size: 0.012\"
4) Thickness tolerance:
A) Single sided: 0.005\"
B) Double sided: 0.010\"
5) Base materials: Polyimide and polyester
6) Conductor (copper thickness): 0.5oz., 10oz. And 20oz. (RA and ED copper)
7) Cover-layer: Polyimide and polyester (solder mask printing is available)
8) Adhesive material: Epoxy, acrylic and polyester
9) Stiffener materials: FR-4, mylar and polyimide
10) Surface finishes: Flash gold plating, selective gold plating and solder plating.
Applications:
Products are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries
Advantage:
1.FPC factory directly
2. FPC high quality
3. FPC good price
4. FPC quick time
5.FPC certification(ISO/UL/RoHS)..
Specifications:
|
SERIAL |
ITEM |
TECHNICAL DATA |
|
1 |
Layers |
1－4(layers) |
|
2 |
Max Board Size |
18\" x 24\" |
|
3 |
Max Board Thickness |
6mm |
|
4 |
Min Line Width |
4mil |
|
5 |
Min Line Space |
4mil |
|
6 |
Min Hole Size |
12mil |
|
7 |
PTH Wall Thickness |
1mil |
|
8 |
PTH dia tolerance |
±3mil |
|
9 |
NPTH hole dia tolerance |
±2mil |
|
10 |
Hole Position Deviation |
±2mil |
|
11 |
Outline Tolerance |
±6mil |
|
12 |
S/M Pitch |
3mil |
|
13 |
Insulation Resistance |
1E+12Ω(Normal) |
|
14 |
Thermal Shock |
288 ℃(3x10Sec) |
|
15 |
Warp and Twist |
≤0.7% |
|
16 |
Electric Strength |
＞1.3KV/mm |
|
17 |
Peel Strength |
1.4N/mm |
|
18 |
Solder Mask Abrasion |
≥6H |
|
19 |
Flammability |
94V-0 |
|
20 |
Electrical test |
10V -250V |
|
Material |
Surface Finish |
|
Polyimide and polyester |
OSP |
|
FR-4 |
HASL |
|
FR-4 High TG |
|
