Specifications
T-962 mini reflow oven- 180x235mm soldering area
- infrared and hot air heating
- original manufacturer
- CE
T-962 mini reflow oven, wave soldering machine, desktop reflow oven, taian, puhui, original manufacturer
Technical parameters
Soldering area: 180*235mm
Overall dimensions: 31*29*17cm
Packing dimensions: 38*24*38cm
Power: 800W
Cycle time: 1-8 min
Voltage: AC110V-AC220V /50-60HZ
Net weight: 6.2Kgs
Gross weight: 8Kgs
Micro-processor controlled reflow oven, suit for various soldering of SMD/BGA automatically, easy operate;
Fast infrared and hot air heating, make temperature more accurate and evenness.
Fuzzy temperature control technology, visualization drawer, can see the whole soldering process very clearly.
It can achieve soldering of single and double-sides PCB board.
FEATURES
(1) A large infrared soldering area
Soldering area: 180*235mm ; this increases the usage range of this machine drastically and makes it an economical investment.
(2) Choice of different soldering cycles
Parameters of eight soldering cycles are predefined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down.
(3) Special heat up and temperature equalization with all designs
Big power of energy efficient Infrared heating and air circulation to re-flow solder.
(4) Ergonomic design, practical and easily operated
Good build quality but at the same time light weight and a small footprint allows the T962 to be easily bench positioned transported or stored.
(5) Large number of available functions
Solder most single or double-sides PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.
Good and safe package