Specifications
1.low profile2.SMT
3.ROHS
Features
1.4.5x4.5mm dimensions with 0.5mm height ,suitable for high density mounting.
2.reflow solderable.
3.save 13% mounting space than conventional 5.2x5.2 type
Applications
For operaing various devices such as mobile phones ,communication devices,video recorders,cameras and audio devices that reqiuire lowprofile and lightweight design.
Specification
Diagram