Features for fpc bonding machine :
1. Unique pulse heat technology provides fastest soldering head heating.
2. Programmable soldering temperature, heat-up rate and time duration for
a wide range of products.
3. Thermocouple is fixed in close proximity to the working surface & the
thermode, thus providing accurate temperature feedback control.
4. Closed Loop PID temperature control with clearly visible LED display.
5. Soldering time can be programmable and is triggered by temperature.
6. Floating thermode ensures consistent pressure and heat transfer
between the thermode head and the parts to be joined.
7. Programmable pressure switch with LCD display for precise force
control.
8. CCD camera system with magnification lens can be retrofitted for finepitch
positioning.
Specification for pcb bonding machine :
Size : 590×640×620mm
Max.working area : 200×260mm
Working air pressure : 0.45~0.70Mpa
Fixture : 1 set
Weight :62 kg
Detailed pictures :
Certificate for bonding machine :
Company information :