|
Layer（Maximum） |
2-18 |
20-30 |
|
Board material type |
FR-4, Ceramic substrate board，Aluminum based board,、High-Tg |
PTFE，PPO ，PPE |
|
Rogers, etc |
E-65，etc. | |
|
Compound material lamination |
4layer—6layer |
6 layer—8layer |
|
Maximum dimension |
610mm X 1100mm |
|
|
Dimension tolerance |
±0.13mm |
±0.10mm |
|
Board thickness coverage |
0.2mm--6.00mm |
0.20mm--8.00mm |
|
Board thickness tolerance ( t≥0.8mm) |
±8% |
±5% |
|
Board thickness tolerance(t＜0.8mm) |
±10% |
±8% |
|
DK thickness |
0.076mm--6.00mm |
0.076mm--0.100mm |
|
Min line width |
0.10mm |
0.075mm |
|
Min line space |
0.10mm |
0.075mm |
|
Out layer copper thickness |
8.75um--175um |
8.75um--280um |
|
Inner layer copper thickness |
17.5um--175um |
8.75um--175um |
|
Drilling hole diameter (Mechanical drill) |
0.25mm--6.00mm |
0.15mm--0.25mm |
|
Finished hole diameter (Mechanical drill) |
0.20mm--6.00mm |
0.10mm--0.20mm |
|
Hole diameter tolerance4 (Mechanical drill) |
0.05mm |
|
|
Hole position tolerance (Mechanical drill) |
0.075mm |
0.050mm |
|
Laser drill hole size |
0.10mm |
0.075mm |
|
Board thickness and hole diameter ratio |
10:1 |
12:1 |
|
Solder mask type |
GGreen、Yellow、Black、Purple、Blue、White, Red |
|
|
Minimum Solder Mask Dam |
0.10mm |
0.075mm |
|
Minimum size of solder mask separation ring |
0.05mm |
0.025mm |
|
Solder mask oil plug hole diameter |
0.25mm--0.60mm |
0.60mm-0.80mm |
|
Impedance control tolerance |
±10% |
±5% |
|
Surface finish |
Hot Air Level、ENIG、Immersion silver、Gold plating, Immersion tin、Gold Finger |
Immersion Tin，OSP |
