Specifications
circuit board1.DIP/SMT pcb assembly
2.From prototypes to mass production
3.Certificates:UL,ROHS,ISO9001
Your Best Choice for Printed Circuit Board Manufacturing & Assembly
OEM/ODM/EMS Services for PCBA:
- PCBA, PCB Board assembly: SMT & PTH & BGA
- PCBA and enclosure design
- Components sourcing and purchasing
- Quick prototyping
- Plastic injection molding
- Metal sheet stamping
- Final assembly
- Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
- Custom clearance for material importing and product exporting
Capability - SMT
- Lines 9(5 Yamaha,4KME)
- Capacity 52 million placements per month
- Max Board Size 457*356mm.(18”X14”)
- Min Component size 0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP
- Speed 0.15 sec/chip,0.7 sec/QFP
Capability - PTH
- Lines 2
- Max board width 400 mm
- Type Dual wave
- Pbs status Lead-free line support
- Max temp 399 degree C
- Spray flux add-on
- Pre-heat 3
Technical Data:
Stencil size/range: | 736x736mm |
Minimum IC pitch: | 0.30mm |
Maximum PCB size: | 1200x 500mm |
Minimum PCB thickness: | 0.35mm |
Minimum chip size: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
Maximum BGA size: | 74x74mm |
BGA ball pitch: | 1.00mm (minimum), 3.00mm (maximum) |
BGA ball diameter: | 0.40mm (minimum), 1.00mm (maximum) |
QFP lead pitch: | 0.38mm (minimum), 2.54mm (maximum) |
Frequency of stencil cleaning: | 1 time/5 to 10 pieces |
Turn Times: | Quick turn are our Specialty |
Volume: | One piece to low valume production quantityes Low cost first article builds Schedule deliveries |
Assembly type: | Surface mount(SMT) assembly Thru-hole Mixed(surface mount and thu-hole) technology Single or double sided placement Cable assembly |
Components type: | Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch
|
Stencil: | Laser cut stainless steel |
Parts procurements: | Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest |
Solder type: | Leaded Lead-free/ROHS compliant |
Other capabilities: | Repair/rework services Mechanical assembly Box build/electromechanical assembly Mould and plastic injection. |
AOI Testing
- Checks for solder paste
- Checks for components down to 0201"
- Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
- BGAs
- Micro BGAs
- Chip scale packages
- Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.
- Power-up Test
- Advanced Function Test
- Flash Device Programming
- Functional testing
Our partners:
Applications:
Defence, broadcasting,medical,telecommunication systems,industrial control, traffic intelligence systems, auto industry, agriculture and so on.
About Fulltronics:
Our service: Design/Layout of Printed Circuit Boards, PCB Fabrication, Component Assembly, Wire Harness Assembly, Box Assembly, Parts Procurement, Component Forming and Electrical Testing.
We are certified with: ISO9001 & ts16949, UL Certification and ROSH if required.
Why choose us?
We purchase material from Original Company and distributers.
We make products by strict engineer processes.
We have strict inspection processes.
We send products by vaccum package,antistatic package and carton box.
QUOTE REQUIREMENTS FOR PCB AND PCB ASSEMBLY:
- Gerber File and Bom List;
- Quantity;
- Technical requirements for quoting reference;
- Clear pictures of PCB or PCB Assembly sample if avaliable.
- Inspection method for PCB Assembly.