silica gel cooling pad 400*200*0.5/1.0/1.5/2.0/2.5mm
High thermally conductivity pad
-Chipset Thermal pad
-Thermal conductivity:>3.0w/m-k
-Industry direct price
-ROHS & UL liste
The HCH High thermally conductivity pad for chipset is designed with very good high thermal conductivity and coherent winding, its thermal conductivity in the thermally conductive gap filling materials is unparalleled.
Features & benefits:
1.High compressibility, soft and flexible, designed for applications in low-stress application environment
2.Nice thermal conductivity
3.Electrical insulation
4.Meet with the environmental requirements of ROHS and UL
5.Natural stickiness
Typical applications:
1.Laptop
2.Communication hardware equipment
3.High-speed hard disk drive equipment
4.Automobile engine control mould
5.Micro processor, memory chip and graphics processor
6.Mobile equipment
Physical properties:
Test item | Test method | Unit | Test value of HCH series | |
HCH600 value | HCH500 value | |||
Color | Visual |
| Blue/Laterite | Blue/Yellow |
Thickness | ASTM D374 | Mm | 0.25 to 5.0 | 0.25 to 5.0 |
Specific Gravity | ASTM D792 | g/cc | 2.85 | 2.7 |
Hardness | ASTM D2240 | Shore C | 30 | 30 |
Tensile strength | ASTM D412 | kg/cm2 | 55 | 55 |
Continuous Use Temp | EN 344 | °C | -40 to 220 | -40 to 220 |
Volume Resistivity | ASTM D257 | Ω-cm | 3.1*1011 | 3.1*1011 |
Breakdown voltage | ASTM D149 | KV/mm | >5.0 | >5.0 |
Flame Rating | UL-94 |
| 94-V0 | 94-V0 |
Conductivity | ASTM D5470 | w/m-k | 6.0 | 5.0 |
Configurations available: 200mm*400mm, 300mm*400mm; specific size could be provided
according to your requirements.
Packaging:
-Carton box & Plastic bags
-430mm*230mm*120mm for 200mm*400mm size
-320mm*320mm*120mm for 300mm*300mm size
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N-South Electronies Company Limited
Mob:0086-755-83259606
Skype: nsouth008, live:ns001_4