X-ray inspection machine NDT-3500A for PCB board inspection
Applications:
1. Semiconductor: Inner structure of IC, FC, CSP package inspection
2. Aluminum casting relates to cars, bubble &fissure of rubber and resin products inspection
3. Short & open circuit in BGA package, bubble area in BGA inspection and auto-judgment
4. Aerospace and military, aerofoil, bullet etc.
5. Troche in medicine, FRP in chemical products, resin, ceramics.
6. Lithium battery, electronic components (capacitor, resistor, diode & audion, led etc.) inspection
Features:
1. Imported Micro X-Ray tube with original packaging(100/130Kv closed tube), highly-sensitive image intensifier, 1.3 million pixels industrial digital CCD camera, able to detect item <5μm,display clear image.
2. Adjustable high power geometric & system magnification, easy to find out tiny defect with high detecting speed.
3. System navigation chart, navigating rapidly and positioning accurately.
4. Observe object at ±70°, detecting from particular angle, easy to detecting inner structure
5.Five axis moving coordinately, with function of CNC auto-detects in quantity, suitable for detecting in large quantity with high accuracy.
6. 23" digital image-special LCD monitor, displaying large and high definition image.
7. Multi-function software system, free maintenance and update for life.
8. Complete seal lead cabinet, comply with the provisions of the international and domestic X-ray safety standards.
Shenzhen Shuttle Star Technology Co., Ltd. is one of the earliest professional BGA rework station manufacturers in China. Ever since founded in 2000, the product structure and performance are improved constantly according to the market demand and the product series has covered the from high-end to low-end and can provide complete solutions for the BGA reparation operation according to the special demand of customer.