Specifications
BGA reballing Machine;large preheat area
Semi-auto machine with vision
industrial computer system;
Electri-motor controlled
Shuttle Star BGA Reballing Machine RW-SV550
Specification
Applicable PCB: | W20*D20~W620*D550mm |
PCB thickness: | 0.5~4mm |
Working table adjustment: | ±120mm forward/backward, ±80mm left/right |
Temperature control: | K-type thermocouple, close cycle controlled |
Upper heater(hot air): | 1200W |
Lower heater(hot air): | 800W |
Bottom IR heater: | 3600W |
Power supply: | AC singal-phase 220V 50/60Hz |
Applicable BGA: | 1*1~70*70mm |
Placement precision: | 0.01mm |
Max BGA weight: | 300g |
Machine Weight: | 95KG |
Machine Dimension: | L850*W750*H630mm |
-----------------------------------------------------------------------------------------------------------------------------Features
