Delivery Time:Prototype 3 days, Mass Production 8 Days
Certification:ISO 9001:2008,ISO 14001:2004, UL, SGS, CTI
FR-1 , FR-2 , FR-4 laminate multilayer double sided pcb board 1oz copper thickness
Specifications
1.All kinds of PCB
2.High precision,100% test
3.HASL,OSP,immersion gold
4.UL,ROHS,ISO9001
5.Good quality, price concessions
2.High precision,100% test
3.HASL,OSP,immersion gold
4.UL,ROHS,ISO9001
5.Good quality, price concessions
General Specifications Capability
Material Requirements:
| Size | Max.Finshed Size | 20.9”x24.4”(530mm x 620mm ) |
| Board Thickness | Standard | 0.004”to0.16 ” ±10% ( 0.1mmto4.0mm±10% ) |
| Min. | Single/ Double-sided:0.008”±0.004”(0.2mm ±0.1mm) | |
| 4-layer:0.01”±0.008”(0.4mm ±0.1mm) | ||
| 8-layer :0.01”±0.008”(0.4mm ±0.1mm) | ||
| Bow and twist | < 7/1000 | |
| Copper Weight | Outer Cu weight | 0.5oz ~ 3.0oz |
| Inner Cu wight | 0.5oz ~ 3.0oz | |
| Laminate Materials | FR-4,FR-1,,FR-2,CEM-1,CEM-3 |
Process Requirements:
| Solder Mask | Color | green,light green,white,black,dark brown,yellow,red,blue |
| Min. solder mask clearance | 0.003”(0.07mm) | |
| Thickness | 0.0005”-0.0007”(0.012mm-0.017mm) | |
| Silkscreen | Color | White,black,yellow,red,blue,green |
| Min. Size | 0.006”(0.15mm) | |
| Surface Finish | HASL,HASL pb free,immersion gold,immersion silver,immersion tin,O.S.P (Entek),S/G plating,ENEPIG,G/F plating,carbon |
Quality Control:
| Electrical testing | Flying Probe Tester | Y |
| Controlled Impedance | Tolerance | ±10% |
| Impedance tester | Tektronix TDS8200 | |
| Routing | End Mills Test | ± 0.006”(0.15mm) |
| CNC Tolerance | ±0.004”(0.1mm) | |
| V-Cut Depth V-cut | FR-4(1/3+-0.1mm);FR-1,FR-2,CEM-1,CEM-3(1/2+-0.1mm) | |
| V-cut angle V-CUT | 15°,18°,30° | |
| V-CUT | line,hole,V-shape |
Certificates
| UL Cert. | Y |
| ISO Cert. | ISO9001 :2008 |
| TS16949 | Y |
| ISO14000 | Y |
