- Layer count: 8
- Base material: FR4
- Copper thickness: 1oz
- Minimum hole size: 0.25mm
- Minimum line width/space: 3mil/3mil
- Solder mask: blue/10 to 30um
- Surface treatment: immersion gold
- Finished board thickness: 1.6mm
- Panel array: four pieces in one panel
- Copper thickness on PTH: 12.7um (minimum), 15um (average)
- Application: Telecom
8 layer HDI PCB
| Brand Name | 3C-TECHNOLOGY |
| Place of Origin | China |
| Model Number | 3C-MHDI-17 |
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