Assembly of the heat sink and DDR-RAM module,LED light bar module and metal frame bezel.Die-cut piece and Laminate.
XBQ-BP series is made of an advanced thermal conductive pressure sensitive adhesive. XBQ-BP series provides a better way for applications requiring good adhesion strength and superior thermal conductive efficiency. XBQ-BP series is suitable to apply to electronic mechanical components assembly such as the heat sink module and LED light bar module to provide a better heat-transfer path between heat-generating components and heat sink or other cooling devices.
Features :
* Complete thickness standard is available.
* Various structures are for different applications.
* Stable and economic.
* Superior adhesion strength and thermal conductive efficiency.
Applications:
* Assembly of the heat sink and DDR-RAM module.
* Assembly of the LED light bar module and metal frame bezel.
* Die-cut piece and Laminate.
