Specifications
BGA soldering station* Close loop PID control, temperture precise and steady;
* solder BGA chips of different specifications
BGA Soldering Station
Specification:
Heating board dimension: L200×W150mm T
emperature range: 0~400oC
Heating board material: AL
Heating power: 800W
Machine dimension: L327×W200×H110mm
Weight: Appox. 5Kgs
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Description:
* Made of quality heating material, controlling temperature stably;
* Close loop PID control completely , temperture is precision and steady;
* Able to solder BGA chip of different specifications at the same time.
