8 layer ENIG pcb and pcba
Item | Manufacture Capability |
Material | FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminum, Metal based/FR1/CEM1/FPC |
Layer No. | 1-- 20 |
Finished Board thickness | 0.2 mm-4.0mm’(8 mil-160 mil) |
Board Thickness Tolerance | ±10% |
Cooper thickness | 0.5 OZ-6OZ (18 um-210 um) |
Copper Plating Hole | 18-40 um |
Impedance Control | ±10% |
Warp &Twist | 0.50% |
Peelable | 0.012"(0.3mm)-0.02’(0.5mm) |
Images | |
Min Trace Width | 0.075mm (3mil) |
Min Space Width | 0.075mm (3mil) |
Min Annular Ring | 0.1mm (4 mil) |
Solder Mask | |
Min Solder Mask Dam | 0.0635 mm (2.5mil) |
Solder mask Clearance | 0.1mm (4 mil) |
Holes | |
Min Hole size (CNC) | 0.1 mm (4 mil) |
Min Punch Hole Size | 0.9 mm (35 mil) |
Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm |
Hole Position Tol | ±0.075mm |
Plating | |
HASL | 2.5um |
Lead free HASL | 2.5um |
Immersion Gold | Nickel 3-7um Au:1-5u'' |
OSP | 0.2-0.5um |
Certificate | ROHS, SGS, UL, ISO9001: 2008,TS16949 |
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