pcb assembly
No. | items | Spec |
1 | Layers | 1 to 24 layer |
2 | Max working panel area | 457 x 610 mm |
3 | Min board thickness | 4 layer: 0.40mm |
6 layer: 0.80mm | ||
8 layer: 1.00mm | ||
10 layer: 1.20mm | ||
4 | Min trace width | 0.10mm |
5 | Min spacing | 0.10mm |
6 | Min hole diameter | 0.20mm |
7 | Min Copper thickness in hole | 0.020mm |
8 | PTH size tolerance | ±0.05mm |
9 | NPTH size tolerance | ±0.025mm |
10 | Hole position tolerance | ±0.05mm |
11 | Dimension tolerance | ±0.1mm |
12 | Min solder mask dam | 0.08mm |
13 | Insulation resistance | 1E+12 Omega(normal condition) |
14 | Max Board thickness/Hole size Rate | 10 : 1 |
15 | Thermal shock endurance | 288 3 times in 10sec |
16 | Max Board twist and wrap | ≤0.7% |
17 | High Vlotage endurance | 1.3KV/mm |
18 | Copper foil peel off endurance | 1.4N/mm |
19 | Hardness of resist ink | ≥6H |
20 | Flame resistance | 94V-0 |
21 | Impedance control | ±5% |
22 | Certificate | ISO 9001:2000;ISO14001;ISO/TS16949:2002 UL E203640 |
