Good price precision part moulds/punch and die of semiconductor
partwuyue01
The following processes are used:
1.3-axis CNC milling
2.CNC turning
3.Wire cut
4.EDM
5.Grinding
6.Drilling
7.Various conventional processes
The strictest quality control ensures that the production of your plastic injection mould is carried out to the highest standards of precision and quality, so your plastic injection moulded component is finished to perfection and can be reproduced in perfectly identical copies.
The main requirements:
1.Good corrosion resistant
2.Good Machinability.
3.Easy to clean
4.Good heat transfer.
5.Homogeneity of steel.
6.Easy ability.
7.Low Cost.
Product name:punch and die of semiconductor
Product size: customization
Material:Japan(SKD11.SKD61.SKH51.S45C)
USA(AISA.D2.H13.P20.M2)
Germany(DIN.2379.2363.2344.2347)
ASSAB(Rigor.Stavax.Impax.Elmax.ASP23)
Hardness:58-60 HRC
Grinding precision:0.001mm
Electric discharge processing precision:0.002mm
Welcome to figure offer, the price is for reference only, we have a professional considerate service to you.
partsiyue01 recommend you punch and die of semiconductor
Contact Yize Mould
Dongguan YIZE MOULD Co.,LTD
punch and die of semiconductor Address: Hexing Road No.122, South Shatou District, Chang'an Town, Dongguan City, Guangdong Province