Delivery Time:customer requirements
Certification:TS16949
Single Sided Immersion Gold FR4+PI Standard Flexible 4 Layer Rigid PCB Board Fabrication
Material: FR4+PI
Surface treatment: immersion Gold
Width/space: 4/4mil
Finish thickness: 0.05mm(flex), 1.6m
Min Hot:0.6mm
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SPECIFICATION |
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Materials |
Polyimide |
Polyester ( PET) |
Remark& |
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(Kapton) |
Test Method |
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1~8(Rigid-Flex & Multilayers FPC) |
1~2 |
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Single Sided |
0.050 mm |
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Double Sided |
0.075 mm |
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Drilling P.T.H. |
0.2 mm |
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Punching |
1.0 mm |
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Conductor Width (W) |
0.025 mm |
W0.5mm |
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Hole Diameter (H) |
0.05 mm (withP.T.H.0.1mm) |
H1.5mm |
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Accumulated Pitch (P) |
0.05 mm (Special0.03mm) |
P25mm |
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Outline Dimension (L) |
0.05 mm |
L50 mm |
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Conductors and Outline (C) |
0.15 mm (Special 0.07mm) |
C5.0 mm |
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Conductors and Coverlay |
0.3~0.5 mm |
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Surface Treatment on |
Soft or Hard Ni/Au Sn/Pb (2~60μm) Primary FluxCarbon Printed 4~10μm Silver Gel printed |
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Terminals and land Areas |
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Insulation Resistance |
1000MW |
IPC-TM-650 2.6.3.2 |
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at Ambient |
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Dielectric Strength |
5KV |
IPC-TM-650 2.5.6.1 |
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Surface Resistance (W) |
5x012 |
2x015 |
IPC-TM-650 2.5.17 |
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Volume Resistivity (W-cm) |
1x015 |
1x015 |
IPC-TM-650 2.5.17 |
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Dielectric Constant (1 MHz) |
4 |
3.4 |
IPC-TM-650 2.5.5.3 |
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Dissipation Factor (1 MHz) |
0.04 |
0.02 |
IPC-TM-650 2.5.5.3 |
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Peeling Strength (180 irection) |
1.2kgf/cm |
1.2kgf/cm |
IPC-TM-650 2.4.9 |
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Solder Heat Resistance |
260 .C/10se |
