Delivery Time:10-12 working days
Certification:UL
1.6mm Blind Via Fr4 High Tg 170 FR 4 PCB 4 Layer For Temperature Module
PCB Data sheets
| PCB SIZE | 173 x 197mm=30PCS |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 4 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
| Prepreg 7628 0.195mm | |
| copper ------- 18um(0.5oz) MidLayer 1 | |
| FR-4 1.0mm | |
| copper ------- 18um(0.5oz) MidLayer 2 | |
| Prepreg 7628 0.195mm | |
| copper ------- 18um(0.5oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 7.9mil/5.9mil |
| Minmum / Maximum Holes: | 0.3/0.3mm |
| Number of Different Holes: | 1 |
| Number of Drill Holes: | 865 |
| Number of Milled Slots: | 90 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-180 TG>170, er<5.4 |
| Final foil external: | 1oz |
| Final foil internal: | 0.5oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold (32.4%) 2 micoinch over 100 microinch nickle |
| Solder Mask Apply To: | Top and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing, Fiducial Marks |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented, Blind via from top to inner layer 2 |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | Temperature module |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
a) Industrial standard material with high Tg (175℃ by DSC) and excellent thermal reliability.
b) Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260℃
c) PCB manufacturing on required specifications. Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.
d) DDU Door to door shipment with competitive shipping cost.
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