Product Details

FR-4 , CEM-3 Double Sided PCB Buried & Blind Holes Immersion Silver / Gold

Brand Name XingdaYun
Place of Origin China
Model Number

Product Features

Delivery Time:Prototype 3 days, Mass Production 8 Days
Certification:ISO 9001:2008,ISO 14001:2004, UL, SGS, CTI

FR-4 , CEM-3 Double Sided PCB Buried & Blind Holes Immersion Silver / Gold   Specifications double side PCB
a.High quality HDI PCB
b.Low cost, No MOQ,
c.Fast delivery time,
d.Excellent after-sale services

double side PCB factory in China   Specifications

1. Material: FR4;
2. Certificate: UL, ISO, TS16949;
3. No MOQ, T/T,Western Union, PayPal avail;
4.Multilayer PCB.

HDI Multilayer PCB Design

1. ONE-STOP-SERVICE

2. OEM service

3. Gerber file needed

4. PCB clone with sample

5. Quality guarantee and professional after-sell service

Our Production Capability for PCB:

Layer 1 to 28 layers
Material type FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness 0.21mm to 7.0mm
Copper thickness 0.5 OZ to 7.0 OZ
Copper thickness in hole >25.0 um (>1mil)
Size - Max. Board Size: 23 × 25 (580mm×900mm)
- Min. Drilled Hole Size: 3mil (0.075mm)
- Min. Line Width: 3mil (0.075mm)
- Min. Line Spacing: 3mil (0.075mm)
Surface finishing HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Solder Mask Color Green/Yellow/Black/White/Red/Blue
Tolerance - Shape tolerance: ±0.13
- Hole tolerance: PTH: ±0.076 NPTH: ±0.05
PCB Packing - Inner packing: Vacuum packing / Plastic bag
- Outer packing: Standard carton packing
Certificate UL, ISO 9001, ISO 14001 
Special requirements Buried and blind vias+controlled impedance +BGA
Profiling Punching, Routing, V-CUT, Beveling
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.

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