SM320F28335-HT High Temperature Digital Signal Controller
SM320F28335-HT Description
The SM320F28335 is a highly integrated, high-performance solution for demanding control applications.
Throughout this document, the device is abbreviated as F28335.
High-Performance Static CMOS Technology
Up to 150 MHz for TC = –55°C to 125°C
and Up to 100 MHZ for TC = 210°C1.9-V Core, 3.3-V I/O Design
High-Performance 32-Bit CPU
IEEE-754 Single-Precision Floating-Point Unit (FPU))
16 × 16 and 32 × 32 MAC Operations
16 × 16 Dual MAC
Harvard Bus Architecture
Fast Interrupt Response and Processing
Unified Memory Programming Model
Code-Efficient (in C/C++ and Assembly)
Six Channel DMA Controller (for ADC, McBSP,
ePWM, XINTF, and SARAM)16-bit or 32-bit External Interface (XINTF)
Over 2M × 16 Address Reach
On-Chip Memory
256K × 16 Flash, 34K × 16 SARAM
1K × 16 OTP ROM
Boot ROM (8K x 16)
With Software Boot Modes (via SCI, SPI, CAN,
I2C, McBSP, XINTF, and Parallel I/O)Standard Math Tables
Clock and System Control
Dynamic PLL Ratio Changes Supported
On-Chip Oscillator
Watchdog Timer Module
GPIO0 to GPIO63 Pins Can Be Connected to One
of the Eight External Core InterruptsPeripheral Interrupt Expansion (PIE) Block
That Supports All 58 Peripheral Interrupts128-Bit Security Key/Lock
Protects Flash/OTP/RAM Blocks
Prevents Firmware Reverse Engineering
Enhanced Control Peripherals
Up to 18 PWM Outputs
Up to 6 HRPWM Outputs With 150 ps MEP Resolution
Up to 6 Event Capture Inputs
Up to 2 Quadrature Encoder Interfaces
Up to 8 32-bit/Nine 16-bit Timers
Three 32-Bit CPU Timers
Serial Port Peripherals
Up to 2 CAN Modules
Up to 3 SCI (UART) Modules
Up to 2 McBSP Modules (Configurable as SPI)
One SPI Module
One Inter-Integrated-Circuit (I2C) Bus
12-Bit ADC, 16 Channels
80-ns Conversion Rate
2 × 8 Channel Input Multiplexer
Two Sample-and-Hold
Single/Simultaneous Conversions
Internal or External Reference
Up to 88 Individually Programmable, Multiplexed
GPIO Pins With Input FilteringJTAG Boundary Scan Support IEEE Standard 1149.1-1990
Standard Test Access Port and Boundary Scan ArchitectureAdvanced Emulation Features
Analysis and Breakpoint Functions
Real-Time Debug via Hardware
Development Support Includes
ANSI C/C++ Compiler/Assembler/Linker
Code Composer Studio IDE
DSP/BIOS
Digital Motor Control and Digital Power
Software LibrariesLow-Power Modes and Power Savings
IDLE, STANDBY, HALT Modes Supported
Disable Individual Peripheral Clocks
Package Option
Ceramic Pin Grid Array (GB)
HLQFP (PTP)
Temperature Range:
GB Package: –55°C to 210°C (GB)
PTP Package: –55°C to 150°C (PTP)
APPLICATIONS
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Available in Extreme (–55°C/210°C)
Temperature Range(1)Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
Texas Instruments high temperature products utilize
highly optimized silicon (die) solutions with design
and process enhancements to maximize performance over
extended temperatures.
