Features
1:1 mix ( no cure by-product)
UltraSoft, low stress applications
Flowable & Easy to Use
Heat Fast Cure
Typical Applications Include:
Automotive electronics
Telecommunications
Computer and peripherals
Thermally conductive vibration dampening
Between any heat-generating semiconductor and a heat sink
Thermal Conductivity | 1.8 | ASTM D5470 | W/m*K |
MixedViscosity | 100,000 | ASTM D2196 | cps |