Product Details

Tg 135 FR4 BGA Circuit Board 10 Layer 1.6mm Digital Signage Board

Brand Name Bicheng
Place of Origin China
Model Number D5G-2010-VR3.0

Product Features

Delivery Time:7-10 working days
Certification:UL

Tg 135 FR4 BGA Circuit Board 10 Layer 1.6mm Digital Signage Board
 
PCB properties

PCB SIZE135 x 136mm=1PCS
BOARD TYPE 
Number of LayersMultilayer, 10 layer PCB
Surface Mount ComponentsYES
Through Hole ComponentsYES
LAYER STACKUPcopper ------- 35um(1oz)+plate TOP Signal
4mil prepreg
copper ------- 35um(1oz) GND Plane
5mil FR-4
copper ------- 18um(0.5oz) SIG1
5mil prepreg
copper ------- 18um(0.5oz) SIG2
5mil FR-4
copper ------- 35um(1oz) PWR Plane
13mil prepreg
copper ------- 35um(1oz) GND Plane
5mil FR-4
copper ------- 18um(0.5oz) SIG3
5mil prepreg
copper ------- 18um(0.5oz) SIG4
5mil FR-4
copper ------- 35um(1oz) GND Plane
4mil prepreg
copper ------- 35um(1oz)+plate BOT Signal
TECHNOLOGY 
Minimum Trace and Space:5mil/4mil
Minmum / Maximum Holes:0.65/3.20mm
Number of Different Holes:19
Number of Drill Holes:643
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Controlno
BOARD MATERIAL 
Glass Epoxy:ITEQ IT180A TG>170℃, er<5.4
Final foil external:1.5oz
Final foil internal:1oz
Final height of PCB:1.6mm ±0.16
PLATING AND COATING 
Surface FinishImmersion gold 0.025µm over 3µm Nickel, 22% area.
Solder Mask Apply To:TOP and Bottom, 12micron Minimum
Solder Mask Color:Gloss Green, Taiyo PSR-2000GT600D
Solder Mask Type:LPSM
CONTOUR/CUTTINGRouting
MARKING 
Side of Component LegendTOP and Bottom.
Colour of Component LegendWhite, IJR-4000 MW300
Manufacturer Name or Logo:Marked on the board in a conductor and leged FREE AREA
VIAPlated through hole(PTH), Fine pitch BGA
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
APPLICATION:Digital Signage
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

 
 
Advantages
 a) High Tg PCB. Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260℃
b) Excellent thermal reliability and CAF resistance providing long-term reliability for industrial and automobile application.
c) PCB manufacturing on required specifications. Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.
d) No MOQ, low cost for small quantity prototypes and samples.
 
 
More Applications in Electronics
Rv Inverter
GPS GSM Tracker
Access Point Wireless
2000W Inverter
Blue Tooth Adapter
 
 
PCB knowledge: Performance parameter of Aluminum, Copper, Iron and Ceremic

MaterialModelHardness HB500KgFDensity (g/cm3)Coefficient of thermal conductivityExpansion coefficient(10E-6/K)
Aluminum1100322.7121823
Aluminum5052682.6813823
Aluminum6061952.715523
Red copperC1100308.940116.7
IronD30041407.8801.2
Ceramic96% AL2O3-3.820-306

 
 
Multilayer PCB stackup: 8 layer 2.4mm Finished Thickness
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