1.Material: FR-4 or other;
2.PCB with HASL Finishing;
3.Complied ROHS standard;
4.Vendor to be UL recognized;
5.Etch on Top/Bottom/Side Copper Layer;
6. All patterns according to Customer PCB Artwork/Film/Gerber File.
|
HDI |
||
|
Item |
Mass Production |
Prototype |
|
HDI structure |
1+N+1,1+1+N+1+1 |
2+N+2 |
|
Buried hole |
Filled |
Filled |
|
Aspect ratio |
0.75:1 |
0.75:1 |
|
Minimum laser hole |
0.1mm(4mil) |
0.1mm(4mil) |
|
Minimum laser pad |
0.25mm(10mil) |
0.25mm(10mil) |
|
Blind hole |
No filled |
No filled |
|
Rigid & Flex board |
NO |
YES |
|
Press fit hole |
YES |
YES |
|
Control Depth drilling |
YES |
YES |
|
Lead-free &Halogen-free |
YES |
YES |
|
Immersion Gold |
Ni:2-5µm Au:0.05-0.10µm |
Ni:3-6µm Au:0.075-0.15µm |
|
Immersion Tin |
0.6-1.2µm |
0.6-1.2µm |
|
Immersion silver |
0.2-0.6µm |
0.3-0.6µm |
|
OSP |
0.1-0.4µm |
0.25-0.4µm |
|
HASL (Sn-Pb&LF) |
Pad:>3µm /Big Cu:>1µm |
Pad:>4µm Big Cu:>1.5µm |
|
Flash Gold |
Ni:3-6µm Au:0.01-0.05µm |
Ni:3-6µm Au:0.02-0.075µm |
