NAND Flash Memory Emmc S3 L710 I535
1.Product Specifications of Emmc S3 L710 I535
1.NAND MLC flash,standard interface
we own independent WAFER cutting, packaging and testing factory
which is the 1st one in South of China.
2. Error correcting code, block management ,wear leveling
command management supported.
3. Low power consumption
Parameters quick view
LFBGA 153-ball:11.5*13*1.0mm,4GB,8GB
LFBGA 169-ball:12*16*1.0mm,8GB,16GB,32GB
2.Product Pictures of Emmc S3 L710 I535
3.Application of Our Products
4.More Products for You to Choose
5. Our Factory View
Our factory has full range of product line:
- PCI-E, 2.5”SATA, 2.5”PATA, 1.8”SATA, 1.8”PATA, Half Slim, NGFF, mSATA, mSATA Mini, SATA DOM, PATA DOM, USB DOM
- Memory Card: CFast Card, CF Card;
- Embedded Chips: eMMC, eMCP;
Applicable to harsh operating temperature environments of industrial grade.
6.Trade Show
7.Certifications
Biwin has passed ISO 9001 ISO 14001 and been audited by SGS. All of our SSD products are RoHS directive-compliant and carry CE, FCC, RoHS approvals.
We offer all the models with 3 years warranty.
8. Our Services
Reliability Testing:
- High and Low Temperature Storage
- High and Low Temperature Operation
- High and Low Temperature Cycling
- ESD Testing
- Vibration and Shock Testing
- Room Temperature Aging Testing
- Power Failure Testing
State-of-the-art Manufacturing:
- Quality Guaranteed Products
- Strict Quality Control Standards
- Short Lead Time
- Low Product Defect Rate
- Large production Capacity
Wafer Packaging Service:
- First 12" Wafer Packaging Factory in South China
- Include IC Design, Packaging, Testing, Assembling
- Wafer Packaging Products:TSOP 48, QFN, QFP, BGA, LGA, eMMC, UDP.
9. Our Markets
10. Welcome to Contact Us