BERGQUIST HF300P HI-FLOW 300P HI-FLOW THF 1600P
BERGQUIST HI-FLOW THF 1600P consists of a thermally conductive 55°C phase change compound
coated on a thermally conductive polyimide film. The polyimide reinforcement makes the material easy
to handle and the 55°C phase change temperature minimizes shipping and handling problems.
BERGQUIST HI-FLOW THF 1600P achieves outstanding values in voltage breakdown and thermal
performance. The product is supplied on an easy release liner for exceptional handling in high
volume manual assemblies. BERGQUIST HI-FLOW 300P is designed for use
as a thermal interface material between electronic power devices requiring electrical isolation to the
heat sink.
BERGQUIST HF300P Typical Applications Include:
• Spring or clip-mounted
• Discrete power semiconductors and modules
Configurations Available:
• Roll form, die-cut parts and sheet form, dry both sides
