BERGQUIST GPHC3.0,GAP PAD HC 3.0,GAP PAD TGP HC3000
BERGQUIST GAP PAD TGP HC3000 is a soft and compliant gap filling material with a thermal conductivity
of 3.0 W/m-K.The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K
filler package and lowmodulus resin formulation. The enhanced material is ideal for applications requiring
low stress on components and boards during assembly. BERGQUIST GPHC3.0 maintains a conformable
nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness
and/or topography.
BERGQUIST GAP PAD HC 3.0 Typical Applications Include:
• Telecommunications
• ASICs and DSPs
• Consumer electronics
• Thermal modules to heat sinks
Configurations Available:
• Sheet form and die-cut parts
For more product information, please feel free to contact us
