BERGQUIST GPVOUS, Thermal Conductive Sheet, Silica Gel Cooling Pad
GAP PAD TGP 1000VOUS, Silicone Thermal Pad For Converter
GAP PAD VO Ultra Soft Interface Pad Heat Transfer Materials
BERGQUIST GAP PAD TGP 1000VOUS(GPVOUS) is recommended for applications that require a minimum amount of pressure
on components. The viscoelastic nature of the material also gives excellent lowstress vibration dampening and shock
absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUS is an electrically isolating material, which allows its use
in applications requiring isolation between heat sinks and highvoltage,bare-leaded devices.
BERGQUIST GAP PAD VO Ultra Soft Typical Applications Include:
• Telecommunications
• Computers and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
• Areas where heat needs to be transferred to a frame, chassis, or other type of
heat spreader
Configurations Available:
• Sheet form and die-cut parts
