BERGQUIST GPVOUS (Thermal Conductive Sheet Silica Gel Cooling Pad)
GAP PAD VO Ultra Soft (Silicone Thermal Pad For Converter)
GAP PAD TGP 1000VOUS(Interface Pad Heat Transfer Materials)
Ultra-Conformable, Thermally Conductive Material for Filling Air Gaps
BERGQUIST GPVOUS is recommended for applications that
require a minimum amount of pressure on components. The viscoelastic nature
of the material also gives excellent low-stress vibration dampening and shock
absorbing characteristics. BERGQUIST GAP PAD VO Ultra Soft is an electrically isolating
material, which allows its use in applications requiring isolation between heat sinks and
high-voltage, bare-leaded devices.
GAP PAD TGP 1000VOUS Typical Applications Include:
• Telecommunications
• Computers and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
• Areas where heat needs to be transferred to a frame, chassis, or other type of
heat spreader
Configurations Available:
• Sheet form and die-cut parts
