Heat Dissipation Material For Phone light amber 0.152mm thickness Thermal Phase Change Material Pad
The TIC™806K Series is low melting point thermal interface material. At 50℃, The TIC™806KSeries begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™806K Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™806K Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
Features
Re-flow compatible
Cost Effective
Used where electrical isolation is not required
Low volatility – less than 1%
Easy to handle in the manufacturing environment
Flows but doesn’t run like grease
Available in custom die-cut shapes, kiss-cut on rolls
Cost Effective
Used where electrical isolation is not required
Low volatility – less than 1%
Easy to handle in the manufacturing environment
Flows but doesn’t run like grease
Available in custom die-cut shapes, kiss-cut on rolls
RoHS Compliant
Applications
IGBTs
COB Led
Desktop PCs
CPU
COB Led
Desktop PCs
CPU
Phone
Micro processors
Chipsets
Graphitc Processing Chips
Custom ASICs
Servers
Memory Modules
Power semiconductors
Power conversion modules
Micro processors
Chipsets
Graphitc Processing Chips
Custom ASICs
Servers
Memory Modules
Power semiconductors
Power conversion modules
