The Ceramics bond Grinding wheels is mainly used for the back of the LED industry sapphire wafer, a silicon wafer, gallium arsenide and other products of thinning. LED substrate grinding wheel produced by our company can replace imported products in Japan, South Korea Stability grinder, grinding wheel excellent performance of this product by the customer feedback.
The main target: sapphire wafer, silicon wafer, gallium arsenide, wafer or the like the GAN.
Material Of Workpiece: synthetic sapphire, silicon, gallium arsenide and gallium nitride and other materials.
Ceramics bond Grinding wheels can be cut free, energy self-trim polished. Ceramics bond Grinding wheels is much larger than the hardness of the resin bonded grinding wheel and a sintered metal grinding wheel, vitrified bond combines the advantages of resin bond and metal bond, which is higher than the resin bonded grinding wheel grinding efficiency, higher than the hardness of the metal bonded grinding wheel , along with the advantages of high hardness, high efficiency, long life, is currently mainly used auto parts, optical glass, glass, ceramic, metal, semiconductor and other industries. The main products are Ceramics bond Grinding wheels.
